Circling the web right now is a Photo dubbed as one of the 3 variants of the upcoming ZenFone 3. The photo was said taken from the ASUS Taiwan HQ by one of the employees, looking at it seems the device is a full metal alloy build with a fingerprint sensor at the back and a smooth texture and also a thin form factor. This week ASUS also unveiled the official teaser of the new devices. ASUS is expected to unveil the new devices this upcoming Computex and we will be there to cover the announcement. Stay tuned for more ZenFone 3 coverage and updates.